Châssis compact Fanless - Player


PC Fanless embedded IEI - Large plage de température - Intel® Core™ i7/i5/i3 or Celeron® mobile - Entrée: 9 V-36 V DC

Châssis Compact & Résisitant
Large plage de température -20°C ~50°C
Solution Fanless
Processeur 2nd Gen Intel® Core™ i7/i5/i3 ou Celeron®
Dual Combo Gigabit Ethernet – Supporte Intel® AMT 7.0
Mémoire : 1 x 2Go DDR3 On-board – 1 x DDR3 libre (10Go Max.)

Points Forts

TANK-820-H61 : Caractéristiques

Color Black C + Silver
Dimensions (WxDxH) 133 mm x 269 mm x 208 mm
System Fan Fanless
Chassis Construction Extruded aluminum alloys
CPU Intel® Core™ i5-2xxT (above 2.7 GHz)
Intel® Core™ i3-2xxT (above 2.5 GHz)
Intel® Pentium® G6xxT (above 2.2 GHz)
Chipset Intel® H61
System Memory On-board DDR3 2 GB memory
1 x 204-pin DDR3 SO-DIMM (system max: 10 GB)
Hard Drive 1 x 2.5'' SATA 3Gb/s HDD/SSD bay
CompactFlash® 1 x CF Type II
USB 3.0 2
USB 2.0 4
Ethernet 2 x RJ-45
PCIe GbE by Realtek 8111E
RS-232 4 x DB-9 (two with isolation)
RS-422/485 2 x RJ-45
Digital I/O 8-bit digital I/O, 4-bit input/4-bit output
Display 1 x VGA, 1 x DVI-I
Resolution VGA: Up to 2048 x [email protected]
DVI-I: Up to 1920 x [email protected]
Audio 1 x Line-out, 1 x Mic-in
PCI 2P1E: 2 x PCI, 1P2E: 1 x PCI
PCIe 2P1E: One PCIe x 8 (physical PCIe x 16 slot)
1P2E: One PCIe x 1 (physical x 4 slot),
One PCIe x 8 (physical x 16 slot)
Power Input Terminal Block: 9 V~24 V DC
DC Jack: 9 V~24 V DC
Power Consumption 19 [email protected] A
(Intel® Core™ i3-2100 with 6 GB DDR3 memory) w/o add-on card
Mounting Wall mount
Operating Temperature -20°C ~ 60°C with air flow (SSD),
5% ~ 95%, non-condensing
Operating Shock Half-sine wave shock 5G, 11ms, 3 shocks per axis
Operation Vibration MIL-STD-810F 514.5C-2 (with SSD)
Weight (Net / Gross) 4.2 kg/6.3 kg