PC Fanless embedded IEI - Large plage de température - Intel® Core™ i7/i5/i3 or Celeron® mobile - Entrée: 9 V-36 V DC

Châssis Compact & Résisitant
Large plage de température -20°C ~50°C
Solution Fanless
Processeur 2nd Gen Intel® Core™ i7/i5/i3 ou Celeron®
Dual Combo Gigabit Ethernet – Supporte Intel® AMT 7.0
Mémoire : 1 x 2Go DDR3 On-board – 1 x DDR3 libre (10Go Max.)

TANK-820-H61 : Caractéristiques

Color	Black C + Silver
Dimensions (WxDxH)	133 mm x 269 mm x 208 mm
System Fan	Fanless
Chassis Construction	Extruded aluminum alloys
CPU	Intel® Core™ i5-2xxT (above 2.7 GHz)
	Intel® Core™ i3-2xxT (above 2.5 GHz)
	Intel® Pentium® G6xxT (above 2.2 GHz)
Chipset	Intel® H61
System Memory	On-board DDR3 2 GB memory
System Memory	1 x 204-pin DDR3 SO-DIMM (system max: 10 GB)
Hard Drive	1 x 2.5'' SATA 3Gb/s HDD/SSD bay
CompactFlash®	1 x CF Type II
USB 3.0	2
USB 2.0	4
Ethernet	2 x RJ-45
Ethernet	PCIe GbE by Realtek 8111E
RS-232	4 x DB-9 (two with isolation)
RS-422/485	2 x RJ-45
Digital I/O	8-bit digital I/O, 4-bit input/4-bit output
Display	1 x VGA, 1 x DVI-I
Resolution	VGA: Up to 2048 x 1536@75Hz
Resolution	DVI-I: Up to 1920 x 1080@60Hz
Audio	1 x Line-out, 1 x Mic-in
PCI	2P1E: 2 x PCI, 1P2E: 1 x PCI
PCIe	2P1E: One PCIe x 8 (physical PCIe x 16 slot)
	1P2E: One PCIe x 1 (physical x 4 slot),
	One PCIe x 8 (physical x 16 slot)
Power Input	Terminal Block: 9 V~24 V DC
Power Input	DC Jack: 9 V~24 V DC
Power Consumption	19 V@3.5 A
Power Consumption	(Intel® Core™ i3-2100 with 6 GB DDR3 memory) w/o add-on card
Mounting	Wall mount
Operating Temperature	-20°C ~ 60°C with air flow (SSD),
Operating Temperature	5% ~ 95%, non-condensing
Operating Shock	Half-sine wave shock 5G, 11ms, 3 shocks per axis
Operation Vibration	MIL-STD-810F 514.5C-2 (with SSD)
Weight (Net / Gross)	4.2 kg/6.3 kg